Bondada Group Walk-in Interview 2026: Bondada Group is conducting a Walk-in Interview Drive for multiple positions in the Telecom Segment. Candidates with SSC, Intermediate, ITI, Diploma, and B.Tech qualifications are eligible to attend. Freshers and experienced candidates having 0–6 years of experience can participate. The walk-in interview will be held on 25 & 26 July 2026. Interested and eligible candidates should attend the interview with all the required documents.
Company Name: Bondada Group
Positions: Technical, Rigger, Supervisor, Engineer, Assistant Splicer, Splicer, FTTX Technician & FTTX Engineer
Job Location: Sangareddy, Miyapur, Jairabad, Kukatpally, JNTU, Lingampally, Nizampet, Bhadurpally, Papanapet & Shapur, Telangana
Salary: Best in the Industry
Qualification & Experience:
Employee Benefits:
- Salary as per Company Policy
- Career Growth Opportunities
- Training & Development Programs
- Other Benefits as per Company Policy
Required Documents:
- Updated Resume
- Passport-size Photograph
- Aadhaar Card
- Educational Certificates
- Experience Certificates (if applicable)
- Driving License (Preferred)
Walk-in Interview Details:
- Date: 25 & 26 July 2026
- Venue: 4th Floor, Reliance Digital, Miyapur, Madinaguda, Telangana – 500049
How to Apply:
Interested candidates should attend the walk-in interview at the scheduled venue with all the required documents. 2-Wheeler and Driving License are mandatory, and male candidates are preferred as per the notification. This is an excellent opportunity to build a career with Bondada Group.
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Kuldeep is a diploma holder and content writer who shares the latest updates on government jobs, campus placement and private jobs.